- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/11 - Lapping tools
Patent holdings for IPC class B24B 37/11
Total number of patents in this class: 68
10-year publication summary
5
|
14
|
8
|
2
|
8
|
4
|
4
|
8
|
6
|
1
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 16587 |
11 |
Ebara Corporation | 1951 |
7 |
Fujimi Incorporated | 676 |
5 |
Tianjin University | 695 |
3 |
Toyo Tire & Rubber Co., Ltd. | 631 |
3 |
Hoya Corporation | 2822 |
2 |
Tsinghua University | 5426 |
2 |
Entegris, Inc. | 1736 |
2 |
Fujibo Holdings, Inc. | 97 |
2 |
Hwatsing Technology Co., Ltd. | 26 |
2 |
Sunnen Products Company | 44 |
2 |
Samsung Electronics Co., Ltd. | 131630 |
1 |
3m Innovative Properties Company | 18406 |
1 |
Panasonic Corporation | 20786 |
1 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1 |
Mitsubishi Electric Corporation | 43934 |
1 |
Huawei Technologies Co., Ltd. | 100781 |
1 |
Corning Incorporated | 9932 |
1 |
Siemens Energy, Inc. | 1770 |
1 |
JPMorgan Chase Bank, National Association | 10964 |
1 |
Other owners | 18 |